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Huawei testing Kirin 990 chip, may debut in Q1 2019

Kirin-3
 
Kirin-3
Chinese tech giant Huawei is working on its next “Kirin 990” chipset with the Taiwan Semiconductor Manufacturing Company (TSMC) which is likely to be unveiled in the first quarter of 2019, the media reported. The processor would feature the second-generation 7nm process and is likely to debut as the first 5G-ready chip from the company.